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ELECTRONICS/ELECTRICAL/SEMICONDUCTOR

Click here to go directly to AURUM-based, 3M™ "Olive" Ultra High Temperature Products section for the semiconductor/electronics industry

Semiconductor

  AURUM is increasingly specified in silicon wafer and microprocessor handling, fabrication, and testing operations for its unique combination of attributes including:

  1. High purity and low trace metal content
  2. Low outgassing at elevated temperatures (ie, 315°C)
  3. Low thermal conductivity
  4. Dimensional stability at elevated temperatures (ie, etching, solder reflow, CVD)
  5. Surface resistivity of 1010 - 1012 Ohms

  AURUM components resist harsh plasma environments and then extreme temperatures found in the CVD, etching, and reflow processes.


(Click here to view the AURUM Outgassing (AURUM, PEEK and Torlon) Charts) 56 kb.


Electronics/Electrical

  AURUM's excellent dielectric properties and resistance to heat and abrasion have led to an increasing number of electronics and electrical applications including hard disk drive components, carriers used during hard disk manufacturing, electrical connectors and coil bobbins.


 

Dielectric Constant and Dissipation Factor of AURUM
.

Frequency
(Hz)

AURUM
PL450

AURUM
JGN3030

Dielectric Constant

60

3.1

3.8

 

1,000

3.2

3.8

.

30,000

3.1

3.8

.

1,000,000

3.1

3.7

Dissipation Factor

60

7.0 E(-4)

1.2 E(-3)

.

1,000

9.0 E(-4)

1.2 E(-3)

.

30,000

2.5 E(-3)

2.5 E(-3)

.

1,000,000

3.4 E(-3)

3.6 E(-3)

 


All-AURUM and AURUM/metal hybrid Hard Disk Carriers provide exceptional dimensional stability at temperatures over 300°C for thousands of cycles.

AURUM Injection Molded Liquid Crystal Display glass carriers withstand LCD processing temperatures over 300°C.

AURUM Injection-Molded Coil Bobbin.

 

Ultra High Temperature UHT Material, "Olive"

3M's new Olive Ultra High Temperature material has been developed to withstand the demanding high temperature processing needs of the electronics industry. The unique material properties enable its use in certain reflow applications, as well as in other potential applications such as high temperature process carriers for the hard disk drive and semiconductor industry. The product's cleanliness (low outgassing, non-sloughing), dimensional stability and electrical properties permit its potential use across a wide range of high temperature applications.

Molded Plastic Advantages

  • Can be molded to meet thick (.480") or thin (.300") JEDEC form factors
  • Increased cell densities over metal boats and trays
  • Allows integration of interlocking stacking features for tray flippability
  • Precise, predictable and stable features and dimensions

Excellent Thermal Characteristics

  • 230°C short-term exposure (<20 min./cycle)
  • 215°C long-term exposure (24 hr.)
  • Excellent thermal stability - meets JEDEC standards for flatness (<.030") after multiple exposures to 230°C temperatures
  • Low thermal mass (low heat capacity)
  • Low heat conductivity

A Wide Range of Productivity Benefits

  • Eliminates transfer from metal boats to JEDEC trays
  • Flippable features permit live and dead bug processing
  • Fully recyclable and reusable materials
  • Higher throughput capability
  • Lower energy costs required to heat and cool 3M ™ Olive Trays as compared to metal fixtures
  • Product may be designed to be compatible with existing capital equipment, providing low program costs



Important Notice

    All statements, technical information, and recommendations related to Seller's products are based on information believed to be reliable, but the accuracy or completeness thereof is not guaranteed. Before utilizing the product, the user should determine the suitability of the product for its intended use. The user assumes all risks and liability whatsoever in connection with such use.
   
Any statements or recommendations of the Seller which are not contained in the Seller's current publications shall have no force or effect unless contained in an agreement signed by an authorized officer of Seller. The statements contained herein are made in lieu of all warranties, expressed or implied, including but not limited to the implied warranties of merchantability and fitness for a particular purpose which warranties are hereby expressly disclaimed.
    SELLER SHALL NOT BE LIABLE TO THE USER OR ANY OTHER PERSON UNDER ANY LEGAL THERORY, INCLUDING BUT NOT LIMITED TO NEGLIGENCE OR STRICT LIABILITY, FOR ANY INJURY OR FOR ANY DIRECT, INDIRECT, INCIDENTAL OR CONSEQUENTIAL DAMAGES SUSTAINED OR INCURRED BY REASON OF THE USE OF ANY OF THE SELLER'S PRODUCTS.


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